B560M DS3H V2 GIGABYTE
B560M DS3H V2 GIGABYTE
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B560M DS3H V2 GIGABYTE COMES WITH FOLLOWING SPECS AND FEATURES
B560M DS3H V2 GIGABYTE
- Supports 11th and 10th Gen Intel® Core™ Series Processors
- Dual Channel Non-ECC Unbuffered DDR4, 4 DIMMs
- Direct 6+2 Phases Digital VRM Solution with Low RDS(on) MOSFETs
- Dual Ultra-Fast NVMe PCIe 4.0/3.0* x4 M.2
- GIGABYTE Exclusive 8118 Gaming LAN with Bandwidth Management
- USB 3.2 Gen1 Type-C® for Fast and Versatile Connections
- High Quality Audio Capacitors and Audio Noise Guard with LED Trace Path Lighting
- RGB FUSION 2.0 Supports Addressable LED & RGB LED Strips
- Smart Fan 6 Features Multiple Temperature Sensors , Hybrid Fan Headers with FAN STOP
- Q-Flash Plus Update BIOS without Installing the CPU, Memory and Graphics Card
- LGA1200 package:B560M DS3H V2 GIGABYTE
- 11th Generation Intel® Core™ i9 processors / Intel® Core™ i7 processors / Intel® Core™ i5 processors
- 10th Generation Intel® Core™ i9 processors / Intel® Core™ i7 processors / Intel® Core™ i5 processors / Intel® Core™ i3 processors/ Intel® Pentium® processors / Intel® Celeron® processors*
* Limited to processors with 4 MB Intel® Smart Cache, Intel® Celeron® G5xx5 family. - L3 cache varies with CPU
(Please refer to “CPU Support List” for more information.)
- Chipset
- Intel® B560 Express Chipset
- B560M DS3H V2 GIGABYTE
- Memory
- 11th Generation Intel® Core™ i9/i7/i5 processors:
Support for DDR4 5333(O.C.) / DDR4 5133(O.C.) / DDR4 5000(O.C.) / 4933(O.C.) / 4800(O.C.) / 4700(O.C.) / 4600(O.C.) / 4500(O.C.) / 4400(O.C.) / 4300(O.C.) / 4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3666(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200 / 3000 / 2933 / 2800 / 2666 / 2400 / 2133 MHz - 10th Generation Intel® Core™ i9/i7 processors:
Support for DDR4 2933/2666/2400/2133 MHz memory modules - 10th Generation Intel® Core™ i5/i3/Pentium®/Celeron® processors:
Support for DDR4 2666/2400/2133 MHz memory modules - 4 x DDR4 DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory
- Dual channel memory architecture
- Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode)
- Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
- Support for Extreme Memory Profile (XMP) memory modules
(Go to GIGABYTE’s website for the latest supported memory speeds and memory modules.)
- 11th Generation Intel® Core™ i9/i7/i5 processors:
- Onboard Graphics
Integrated Graphics Processor-Intel® HD Graphics support:
- 1 x DVI-D port, supporting a maximum resolution of 1920×1200@60 Hz
* The DVI-D port does not support D-Sub connection by adapter. - 1 x DisplayPort, supporting a maximum resolution of 4096×2304@60 Hz
* Support for DisplayPort 1.2 version and HDCP 2.3 - 1 x HDMI port, supporting a maximum resolution of 4096×2160@30 Hz
* Support for HDMI 1.4 version and HDCP 2.3.
- 1 x DVI-D port, supporting a maximum resolution of 1920×1200@60 Hz
(Graphics specifications may vary depending on CPU support.)
Support for up to 3 displays at the same time
- AudioB560M DS3H V2 GIGABYTE
- Realtek® Audio CODEC
- High Definition Audio
- 2/4/5.1/7.1-channel
* To configure 7.1-channel audio, you need to open the audio software and select Device advanced settings > Playback Device to change the default setting first.
- LANB560M DS3H V2 GIGABYTE
- Realtek® GbE LAN chip (1 Gbps/100 Mbps)
- Expansion SlotsB560M DS3H V2 GIGABYTE
- 1 x PCI Express x16 slot, running at x16
(The PCIEX16 slot conforms to PCI Express 4.0 standard.)(Note) - 2 x PCI Express x1 slots
(The PCIEX1 slot conforms to PCI Express 3.0 standard.)
(Note) Supported by 11th Generation processors only.
- 1 x PCI Express x16 slot, running at x16
- Storage InterfaceCPU:B560M DS3H V2 GIGABYTE
- 1 x M.2 connector (Socket 3, M key, type 2260/2280/22110 PCIe 4.0 x4/x2 SSD support) (M2P_CPU)(Note)
Chipset:
B560M DS3H V2 GIGABYTE- 1 x M.2 connector (Socket 3, M key, type 2260/2280 SATA and PCIe 3.0 x4/ x2 SSD support) (M2A_SB)
- 6 x SATA 6Gb/s connectors
* Refer to “1-7 Internal Connectors,” for the installation notices for the M.2 and SATA connectors.
Intel® Optane™ Memory Ready
* System acceleration with Intel® Optane™ Memory can only be enabled on the M2P_CPU connector and with an 11th Generation Intel® processor installed.(Note) Supported by 11th Generation processors only.
- USB
Chipset:
- 1 x USB Type-C® port on the back panel, with USB 3.2 Gen 1 support
- 5 x USB 3.2 Gen 1 ports (3 ports on the back panel, 2 ports available through the internal USB header)
- 4 x USB 2.0/1.1 ports (2 ports on the back panel, 2 ports available through the internal USB header)
Chipset+USB 2.0 Hub:
- 2 x USB 2.0/1.1 ports available through the internal USB headers
- Internal I/O Connectors
- 1 x 24-pin ATX main power connector
- 1 x 8-pin ATX 12V power connector
- 1 x CPU fan header
- 3 x system fan headers
- 1 x addressable LED strip header
- 1 x RGB LED strip header
- 6 x SATA 6Gb/s connectors
- 2 x M.2 Socket 3 connectors
- 1 x front panel header
- 1 x front panel audio header
- 1 x USB 3.2 Gen 1 header
- 2 x USB 2.0/1.1 headers
- 1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only)
- 1 x serial port header
- 1 x parallel port header
- 1 x Clear CMOS jumper
- 1 x Q-Flash Plus button
*All fan headers are subject to support AIO_Pump, Pump and high performance fan with the capability of delivering up to 2A/12V @ 24W.
- Back Panel Connectors
- 2 x USB 2.0/1.1 ports
- 1 x PS/2 keyboard/mouse port
- 1 x DVI-D port
- 1 x DisplayPort
- 1 x HDMI port
- 3 x USB 3.2 Gen 1 ports
- 1 x USB Type-C® port, with USB 3.2 Gen 1 support
- 1 x RJ-45 port
- 3 x audio jacks
- I/O Controller
- iTE® I/O Controller Chip
- H/W Monitoring
- Voltage detection
- Temperature detection
- Fan speed detection
- Fan fail warning
- Fan speed control
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